New Software Development Kit Brings High-Performance Thermal Simulation And GPU-Accelerated Speed To Integrated Engineering Workflows. MONTREAL, /CNW/ - Maya HTT today announced the launch of the ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Analog fabs are bolstering their electronic design automation (EDA) tool repository to complement design flows in advanced RF devices, and the latest example comes from Tower Semiconductor’s adoption ...

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...

Artificial intelligence (AI) is no longer a research concept — it is the economic engine driving infrastructure investment worldwide. The growth of AI data centers, powered by high-performance CPUs, ...

Vishay Intertechnology, Inc. introduced a new version of its free ThermaSim online thermal simulation tool for power MOSFETs, microBUCK® power ICs, and DrMOS products: ThermaSim 3.0. For precise ...

With concerns over air pollution and petroleum supplies, the use of hybrid electric vehicles (HEVs) and electric vehicles (EVs) have come to the forefront as alternatives to conventional gasoline and ...

There are two golden rules to thermal design: start simple and start early. The heat-flow path from the junction to the ambient, usually air in the local environment, determines a component’s ...

Thermal management has long been a key challenge facing design engineers. For decades, engineers have faced trying to dissipate heat from densely packed electronics that have continued to shrink in ...