Dynamic modelling and control of robotic systems constitute a vital area of research, where the formulation of precise mathematical models of robot dynamics underpins the design of effective control ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Vapor compression cycles are predominantly used in air-conditioning, heat pump and refrigeration equipment. A good understanding of transient behaviors of vapor compression systems is critical to ...