TEMPE, AZ--(Marketwire - Oct 22, 2012) - EPEPS -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced enhancements to its Allegro ® 16.6 ...
Chips are getting bigger in a bid to offer more functionality, and conversely, packages are required to house these bigger die sizes in even more compact form factors. That inevitably mandates new ...
Don't be so stuck in the circuits that you forget the importance of IC packages. Here are a couple cards from the Microchip 2005 product selector: While most design engineers are using surface mount ...
SUNNYVALE, Calif.--(BUSINESS WIRE)-- Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced the launch of its Integrated ...
Concurrent design of a chip and its packaging environment is becoming more important than ever for several reasons. Designing a large, high power die, e.g. a System-on-Chip (SoC), without considering ...
The use of FinFET devices in next-generation high-performance, low-power designs is a fundamental shift that is happening in the semiconductor industry. These devices through their smaller sizes, ...
SANTA CLARA, Calif., Sept. 5, 2017 /PRNewswire/ -- AnaGlobe Technology, Inc., a leader in layout integration solutions, will announce a unified chip-package layout solution, with features and extended ...
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