A new technical paper titled “A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic Flame-Off Errors of Wire-Bonding Semiconductor Package” was published by ...

In this Q&A, you will learn about some of the technologies and techniques that are making it possible to address advanced packaging challenges.

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

The research team led by Distinguished Research Fellow Dr. Jun-Yeob Song at the Semiconductor Manufacturing Research Center, KIMM, is holding a large rectangular panel developed in collaboration with ...

Nordson Electronics Solutions, focused on reliable electronics manufacturing technologies, will demonstrate its latest equipment for semiconductor manufacturing at SEMICON China 2026, booth 3601 (Hall ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

Bumping technologies for advanced semiconductor packaging have evolved significantly to address the challenges posed by shrinking contact pitches and the limitations associated with conventional ...

SEMICON Taiwan 2024 featured the latest trends and innovations that focused on the future of Artificial Intelligence (AI) to connect Taiwan and global semiconductor ecosystems. The high demand and ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...