This book is the fourth volume in the New Era Electronics lecture notes series, a compilation of volumes defining the important concepts tied to the electronics transition happening in the 21st ...

The semiconductor industry faces mounting challenges as the development of next-generation chips pushes against fundamental physical limits. In response, Cadenc ...

LMU researchers have directly measured a physical phenomenon that was theoretically described all the way back in 1933 – the polaron. When an electron travels through a polar crystalline solid, its ...

Researchers at the University of Jyväskylä (Finland) have led an international collaboration to study how semiconductor materials enable the production of green hydrogen through ...

Dr. Simon Min Sze, a semiconductor physics visionary most notable for his contributions to the invention of the world's first floating-gate metal-oxide-semiconductor field-effect transistor (MOSFET), ...

Are your environmental test results exposing true device weaknesses, or just reflecting extreme stress conditions?

UB has launched its Center for Advanced Semiconductor Technologies to cement its position nationally and globally as a leader in microelectronics and research innovation for the semiconductor industry ...

Metal-Semiconductor Field-Effect Transistors (MESFETs) have long been pivotal in bridging fundamental semiconductor physics with high-performance electronic applications. As devices that combine metal ...

How it works Schematic showing how a five-electron droplet (shown in blue) is transported inside the selected potential minimum of a SAW. Electrostatic gates (yellow) are used to guide the electron ...

Seebeck coefficient against electric conductivity measurements of RR and RRa-P3HT doped with iodine and measured while dedoping. We took Rd= 0.21 nm to match the radius of iodide anion ( R I = 0.206 ...

Semiconductor testing has traditionally functioned as a stable screening step in the manufacturing flow so that failing devices can be identified and separated prior to packaging. Test infrastructure ...