Plymouth, WI — February 2026 — Kurtz Ersa Inc. is strengthening its position in microelectronics and semiconductor technology. Effective September 1, 2025, ATV Technologie GmbH officially became part ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

A new 3D glass printing process developed at Karlsruhe Institute of Technology (KIT), Germany, produces nanometer-fine quartz glass structures that can be printed directly onto semiconductor chips. A ...

Microwave cold sintering process (MW-CSP) was used to densify NaCl, KDP, MgMoO₄, Li₂MoO₄, and TiO₂ ceramics. Under the fundamental densification mechanisms dominated by the coupling of the transient ...

(Nanowerk Spotlight) Ceramics are an important class of materials with widespread applications in electronics and energy storage due to their high thermal, mechanical, and chemical stability.

Tolerating heat and helping to reduce it are both attributes that sintering offers as an alternative to soldering in power electronics applications. Doing more with less and, of course, packing more ...