FREUDENSTADT, Germany, March 04, 2026 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD) has successfully delivered the first specialized InfinityLine H+ system designed for Panel-Level Packaging (PLP) ...

As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal point, attracting ...

Market Scale and Growth Trajectory According to data published by industry analysts, the global PET film market was valued at approximately USD 18–20 billion in recent years and is projected to grow ...

(MENAFN- EIN Presswire) EINPresswire/ -- A growing emphasis on advanced semiconductor packaging solutions is shaping the organic substrate packaging material market. As technology evolves rapidly, ...

Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...

DELRAY BEACH, Fla., Oct. 31, 2025 /PRNewswire/ -- The MEMS packaging substrate market is expected to grow from USD 2.40 billion in 2025 to USD 3.23 billion by 2030, at a CAGR of 6.1% according to a ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

South Korean giants Samsung Electronics and SK Group are "speeding up efforts" to secure future dominance in glass substrates, which would be a "game-changer" for the semiconductor and AI industries.

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

Low-cost high-performance flexible substrate materials are now available. Solderable up to 300°C, they come with 1 oz of copper (and other custom thicknesses) on ...

Multi-die assemblies offer significant opportunities to boost performance and reduce power, but these complex packages also introduce a number of new challenges, including die-to-RDL misalignment, ...