The automatic detection of surface-level irregularities—defects or anomalies—in 3D data is of significant interest for ...

Figure 1. Ultrasonic testing using pulse echo and through-transmission methods. Pulse echo (left and center) uses a transducer that sends and receives ultrasound energy, producing both A- and B-scan ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Processing diamond surfaces with femtosecond lasers yields a trade-off between hydrophilicity and low defect rate.

Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...

Using atomic-scale defects in diamond, researchers in China have gained unprecedented insights into the complex chemical ...