Ironwood Electronics has released a new test socket for BGA devices; it features a clamshell lid design for ease of chip replacement in the production environment. Besides final production test, the ...

1. The OSD335x is an example of a complete system fitting into a tiny BGA package. We also discussed the advantages SiP brings to the design and manufacturing of semiconductors and how they can be ...

Taiwan-based WinWay Technology, a dedicated supplier of IC test interface solutions, has plans to expand production capacity for high-frequency and high-speed IC test sockets in 2021 to meet robust ...

Demand for highly-customized IC sockets will sustain growth momentum in 2021 along with increasing application of SiP (system in package) technology to heterogeneous chips integration, according to ...

BANGALORE, India, July 11, 2024 /PRNewswire/ -- Semiconductor Test Socket Market is Segmented by Type (Burn-in Socket, Test Socket), by Application (IC Design Company, Packaging Company, IDM, ...