The high power density in turn produces large thermal gradients, with the low to max temperature changes increasing ...
The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...
Semiconductor testing has traditionally functioned as a stable screening step in the manufacturing flow so that failing devices can be identified and separated prior to packaging. Test infrastructure ...
Test-flow partitioning between wafer sort and final package test can have a dramatic impact on the cost of test. In some cases, the migration of package tests can be done over time, but the test ...
GRENOBLE, France--(BUSINESS WIRE)--Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced a breakthrough magnetic test head revolutionizing ...
The emergence of 3-D ICs presents test challenges that extend from design-for-test tools from design-automation companies to device handlers from equipment firms including Advantest and Multitest. A ...
The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the ...
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced the successful production of the world’s first semiconductor wafer whose ...
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