Electronics Weekly

LETI integrates III-V lasers on 200mm wafers using CMOS flow

Leti has integrated hybrid III-V silicon lasers on 200mm wafers using standard CMOS process flow. This shows the way to transitioning away from 100mm wafers and a process based on bulk III-V ...
EDN

Mixed-signal design flow enables RF CMOS chip

Spirea AB is a Swedish fabless semiconductor company developing highly integrated low-power, low-cost radio solutions for the Wireless LAN and PAN markets. This article describes how we assembled a ...
Electronic Design

IEDM sees transistor, memory, laser innovations

The International Electron Devices Meeting (IEDM) held Dec. 2-6, 2017, in San Francisco offered imec and Leti an opportunity to disclose several innovations. imec announced three new developments: ...
Electronic Design

Creating On-Chip MEMS Sensors in CMOS

Nanusens' novel approach to creating nanoscale sensor structures inside the CMOS layers. How the methodology helps shrink cost and size. Previously, MEMS sensors were created by employing proprietary ...