Interconnects for advanced packaging are at a crossroads as an assortment of new package types are pushing further into the mainstream, with some vendors opting to extend the traditional bump ...

Chiplets are like smaller, specialized chips that can be combined to create a bigger, more powerful system. Heterogeneous integration is the fancy term for putting these different chiplets together in ...

Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...

Impact of PCB plating Finish on Elastomer Socket Technology Ila Pal – Ironwood Electronics Introduction Today’s electronic packages have high clock speeds (multi GHz range), fine pin densities (below ...